I-THERM ... : [proceedings] /

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Bibliographic Details
Continued as:	Intersociety Conference on Thermal Phenomena in Electronic Systems. I-THERM
Corporate Authors:	InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components, IEEE Components, Hybrids, and Manufacturing Technology Society
Format:	Conference Proceeding
Language:	English
Published:	New York, N.Y. : IEEE, 1988.
Subjects:	Electronic apparatus and appliances > Thermal properties > Congresses. Electronic apparatus and appliances > Design and construction > Congresses. Heat > Transmission > Congresses. Electronic apparatus and appliances > Thermal properties. Electronic apparatus and appliances. Electronic apparatus and appliances > Design and construction. Heat > Transmission. Heat. Conference papers and proceedings.

Annex

Holdings details from Annex
Call Number:	TK 7870.25 .I68
Volume Holdings:	1st(1988)
1st 1988	Available Request Request a scan of an article or book chapter