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Bibliographic Details
Formerly known as:	International Conference on Wafer Scale Integration. Proceedings
Corporate Authors:	International Conference on Innovative Systems in Silicon, IEEE Computer Society, Components, Packaging & Manufacturing Technology Society
Format:	Conference Proceeding
Language:	English
Published:	[New York, N.Y.] : Institute of Electrical and Electronics Engineers, ©1996-
Subjects:	Integrated circuits > Very large scale integration > Congresses. Integrated circuits > Wafer-scale integration > Congresses. Semiconductors > Congresses. Integrated circuits > Very large scale integration. Integrated circuits. Integrated circuits > Wafer-scale integration. Semiconductors. Conference papers and proceedings.
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Annex

Holdings details from Annex
Call Number:	TK 7874 .I578
Volume Holdings:	8th (1996) 2nd (1997)
2nd 1997	Available Request Request a scan of an article or book chapter
8th 1996	Available Request Request a scan of an article or book chapter