Thermal management handbook : for electronic assemblies /
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| Main Author: | |
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| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
1998.
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| Series: | Electronic packaging and interconnection series.
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| Subjects: |
Annex
| Call Number: |
TK 7870.25 .S47 1998
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| Available Request Request a scan of an article or book chapter |